The global photoresist and photoresist ancillaries market size is estimated to be USD 3.3 billion in 2020 and projected to reach USD 4.2 billion by 2025, at a CAGR of 4.8%. A photoresist is a light-sensitive chemical used to create the desired pattern on the substrate during photolithography or photoengraving.
In a positive resist, the portion of the photoresist that is exposed to light becomes soluble in the photoresist developer. The unexposed portion of the photoresist remains insoluble in the photoresist developer. A negative photoresist is a type of photoresist in which the portion that is exposed to light becomes insoluble in the photoresist developer. The photoresist developer dissolves the unexposed portion of the photoresist.
Photoresists are classified broadly based on their response to a specific wavelength of light. These materials are sensitive to wavelengths 193 nm (ArF), 248 nm (KrF), 365 nm (I-line), and 436 nm (G-line). Among the mentioned photoresists, ArF is the most widely used as it provides superior resolution with low defect levels, owing to its narrow wavelength and ability to break through a 10 nm level. Antireflective coating, developer, and remover are some of the types of photoresist ancillaries that are majorly used during photolithography.
The key companies profiled in the photoresist and photoresist ancillaries market report are Tokyo Ohka Kogyo Co., Ltd (Japan), JSR Corporation (Japan), DuPont (US), Shin-Etsu Chemical Co., Ltd (Japan), Fujifilm Corporation (Japan), Sumitomo Chemical Co., Ltd. (Japan), ALLRESIST (Germany), Merck Group (Germany), Micro Resist Technology (Germany), and DJ MicroLaminates (US).
