Higher Integration: 3D ICs allow for the integration of multiple components in a small space, reducing the overall size of the chip. This is particularly useful for mobile devices, which have limited space for components. Improved Reliability: The stacking of multiple layers of ICs improves the reliability of the chip by reducing the risk of single-point failures. Additionally, 3D ICs can be designed with redundant components, which further improves reliability. Despite the many benefits of 3D ICs, there are also several challenges associated with their implementation. Some of these challenges include: Thermal Management: The stacking of multiple layers of ICs increases the heat density of the chip, which can lead to thermal issues. Thermal management is critical for ensuring the reliability and performance of 3D ICs.
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